2 pad ceramic package quartz crystal, 3.2 mm x 5 mm ilcx03 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 02/09 specifications subject to change without notice page 1 recommended pad layout connection diagram dimension units: mm 1.3 1.5 2.4 1.3 max. 3.2 2.00 3.5 5.0 product features: applications: low cost smd package fibre channel low esr server & storage compatible with leadfree processing sonet /sdh 802.11 / wifi t1/e1, t3/e3 * not available at all frequencies. ** not available for all temperature ranges. frequency 10 mhz to 100 mhz esr (equivalent series resistance) 10.0 mhz ? 13.9 mhz 14.0 mhz ? 19.9 mhz 20.0 mhz ? 39.9 mhz 40.0 mhz ? 66.0 mhz 30.0 mhz ? 100.0 mhz (3 rd o.t.) 100 ? max. 80 ? max. 60 ? max. 40 ? max. 100 ? max. shunt capacitance (c0) 7 pf max. frequency tolerance @ 25 c 30 ppm standard (see part number guide for more options) frequency stability over temperature 50 ppm standard (see part number guide for more options) crystal cut at cut load capacitance 18 pf standard (see part number guide for more options) drive level 500 uw max. aging 5 ppm max. / year standard temperature operating 0 c to +70 c standard (see part number guide for more options) storage -40 c to +85 c standard part number guide sample part number: ilcx03 - fb1f18 - 20.000 package tolerance (ppm) at room temperature stability (ppm) over operating temperature operating temperature range mode (overtone) load capacitance (pf) frequency ilcx03 - b = 50 ppm b = 50 ppm 0 = 0c to +50c f = fundamental 18 pf standard. or specify - 20.000 mhz f = 30 ppm f = 30 ppm 1 = 0c to +70c 3 = 3 rd overtone g = 25 ppm g = 25 ppm 2 = -10c to +60c h = 20 ppm h = 20 ppm 3 = -20c to +70c i = 15 ppm i = 15 ppm** 5 = -40c to +85c j = 10 ppm* j = 10 ppm** 9 = -10c to +50c
2 pad ceramic package quartz crystal, 3.2 mm x 5 mm ilcx03 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 02/09 specifications subject to change without notice page 2 pb free solder reflow profile: typical circuit: *units are backward compatible with 240c reflow processes package information: msl = 1 termination = e4 (au over ni over w base metal). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: ilsi, date code (yww) line 2: frequency quantity per reel 1000 a 12 +/-.3 b 8 +/-.2 c 5.5 +/-.2 d 13.5 +/-1 or 12 +/-3 e 60 / 80 f 180 / 250
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